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SIIP China: SEMI Innovation and Investment Forum
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Attendee Registration Previous Review
The first 100 paid visitor will have the chance to win Apple Watch! And please be our guest to join the Luck Draw for the Mystery Grand Prize!The passing 2017 sees the escalating competition and as the Moore’s law approaching its limit, new applications such as cloud computing, big data, IoT and artificial intelligence etc. are surging. The global semiconductor industry is entering a major period of transition and change. Being the biggest integrated circuit consumer market in the world, China has been keeping a two-digit growth these years with manufacturing, design and packaging & test being the three industrial pillars. Competitions on funds, technology, products and talents have been intensifying and the strong demands have vigorously boosted the semiconductor industry.
SIIP China, SEMI Innovation Investment Platform, aims to be one of the most collaborative and influential investment platform for global semiconductor industry by leveraging SEMI global industrial resources, together with global industrial capital and intelligence. SIIP China: SEMI Innovation and Investment Forum, is one of SIIP China’s brand activities held simultaneously with the annual SEMICON China. Besides TIIF, SIIP China series also include China Forums held in San Francisco and Munich along with SEMICON West and SEMICON Europa, respectively. SIIP China will have Delegations to overseas every year as well.
TIIF 2018 will focus on the latest policies, diagnose the current situation of the industry, analysis the capital flows and forecast the future. The AI forum will discuss how semiconductors can promote the innovations and developments of AI and how AI can bring out realistic functions as well as create more intelligent manufacturing and life by means of deep learning, big data & cloud computing, VR /AR. Semiconductor equipment and materials have been the hotspots of the industry and have drawn much the attention. At the second forum in the afternoon, we will have an overview of the investment and merge & acquisitions of this sector and also, look forward to the future for the challenges and opportunities.
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Agenda / 会议日程：
| 09:00-09:30 | Registration 来宾登记 |
09:30-09:35
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Welcome Remarks and Introduction of the Moderator 开幕致辞并介绍主持人 Lung Chu President, SEMI China; Vice President, SEMI 居龙，SEMI全球副总裁、中国区总裁 |
09:35-09:45
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Moderator introduces Speakers 主持人介绍出席嘉宾 Liangsheng, BDA Administrative Commission Director 梁胜，北京经济技术开发区管委会主任 |
09:45-10:05
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Keynote Speech 主题演讲 Ding Wenwu President, China National IC Industry Investment Fund Chairman, China High-end Integrated Circuits Alliance 丁文武，国家集成电路投资基金总裁，中国高端芯片联盟理事长 |
10:05-10:20
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Opening Remarks 致辞 Ye Tianchun Director, Institute of Microelectronics Chinese Academy of Sciences 叶甜春，中国科学院微电子研究所所长 |
| 10:20-10:50 |
Signing ceremony of MOU between SEMI China and SIIP China partners SIIP China合作备忘录签约仪式 |
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The Integrated Circuit Industry Technology Innovation Alliance 集成电路产业技术创新战略联盟 |
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Techcode SME Services 太库科技创业发展有限公司 |
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Business Cluster Semiconductors Netherlands (BCS) 荷兰半导体协会 |
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Shenzhen M&A Association of Listed Companies 深圳市上市公司并购协会 |
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Shaanxi Institute of Optoelectronic Integrated Circuit Led Technology 陕西光电子集成电路先导技术研究院 |
| AM Speeches 嘉宾演讲 | |
10:50-11:10
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Wei Shaojun Director, Institute of Microelectronics, Tsinghua University 魏少军， 清华大学微电子学研究所所长 |
11:10-11:30
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Shen Weiguo Chairman of the Board, Shanghai Integrated Circuit Industry Investment Fund General Manager, Shanghai S&T Investment Co., Ltd. 沈伟国，上海集成电路产业投资基金董事长，上海科技创业投资（集团）有限公司董事总经理 |
11:30-11:50
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Rick Hemond Chief Marketing Officer, Dow Electronic Materials |
| 11:50-13:30 | Lunch break 午休 |
| PM Sessions | |
| 13:30-15:00 |
Panel Discussion 1 主题论坛1 Topic: Trends and Investment Opportunities in Artificial Intelligence 主题：人工智能领域的发展趋势及投资机遇 |
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Wu Ping President, Summitview Capital 武平，武岳峰资本创始合伙人 |
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Allen Wu EVP and President, ARM Greater China 吴雄昂，ARM大中华区全球执行副总裁兼大中华区总裁 |
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Sean Ding CTO, IoT BU, Alibaba 丁险峰，阿里云事业群-IoT事业部-技术部CTO，阿里巴巴 |
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Tammy Kiely Managing Director, Security and Investment Service, Goldman Sachs |
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Farhan Ahmad Vice President, Credit Suisse |
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Christopher Thomas Managing Partner, Global Digital and Advanced Technology Strategy Practice & Asia Semiconductor Practice, McKinsey & Company, Inc. 唐睿思，麦肯锡公司全球董事合伙人，全球数字化及先进技术战略业务负责人&亚洲半导体业务负责人 |
| 15:00–16:30 |
Panel Discussion 2 主题论坛2 Topic: Semiconductor Supply Chain (Equipment and Materials) 主题：半导体产业链（设备和材料） |
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Zhang Guoming Senior Vice President & Chief Strategy Officer, NAURA 张国铭，北方华创科技集团服务有限公司高级副总裁&首席战略官 |
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SHUJI DINGLEE Global Head, Lithography Business, The Dow Chemical Company 丁术季，陶氏化学Lithography Technologies事业部全球总裁 |
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Liu Xinyu Managing Partner, CGP Techfund 刘新玉，盛世投资管理合伙人 |
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Xu Wei Secretary of the Party Committee, Executive Vice President, Shanghai Huahong Grace Semiconductor Manufacturing Corporation Secretary-General of Shanghai Integrated Circuit Industry Association 徐伟，上海华虹宏力半导体制造有限公司党委书记、执行副总裁，上海市集成电路行业协会秘书长 |
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Wang Hui CEO & President, ACM Research (Shanghai), Inc. 王晖，盛美半导体设备（上海）有限公司首席执行官兼董事长 |
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Li Qing Managing Director of Suzhou Crystal Clear Chemical Company 李勍，苏州晶瑞化学股份有限公司执行董事 |
| 16:30–16:40 |
Lucky Draw (Sponsored by CDICV) 观众抽奖（由成都芯谷特别赞助） |
| 16:40–16:45 | Thank you 致谢结束 |
| Agenda is subject to change 议程变化恕不另行通知 | |