Li Zheng

Chief Executive Officer, JCET Group

Mr. Zheng Li is the Chief Executive Officer and Board Director of JCET Group. He holds a Master’s degree in Economics from the University of Tokyo and a Bachelor’s degree in Industrial Management Engineering from Tianjin University. As a seasoned professional in the integrated circuit industry, Mr. Zheng has accumulated over 30 years of global experience in the United States, Japan, Europe, and China. He has previously served in senior management roles such as Senior Vice President at SMIC, Global Senior Vice President and President of Greater China at NXP, and CEO of Renesas Electronics Greater China.

Mr. Li currently serves as SEMI's International Board Director, Vice Chairman of the China Semiconductor Industry Association (CSIA), Acting Chairman of the CSIA IC Packaging & Testing Committee, Vice Chairman of the China Integrated Circuit Innovation Alliance, Rotating Chairman of the China IC Packaging & Testing Innovation Alliance, and Vice Chairman of the Shanghai Integrated Circuit Industry Association.

Speech Abstract:

Co-Development and Co-Manufacturing: Forging a New Frontier for Moore's Law

When wafer fabrication approaches its physical limits, advanced packaging emerges as an indispensable innovation engine in the post-Moore era. By implementing “co-development” to precisely customize chiplet and packaging solutions, barriers between front-end IC design and back-end manufacturing can be eliminated. Meanwhile, leveraging “co-manufacturing” to establish high-efficiency, cross-regional and cross-process production lines enables cutting-edge chips to achieve breakthroughs in performance and yield through microsystem integration, thus offering new opportunities to extend Moore’s Law. Drawing on practices from IC packaging and test companies and their partners, this talk explores how to achieve large-scale production of advanced packaging technologies through ecosystem collaboration, fully empowering AI, cloud computing, automotive electronics, and other emerging applications, and thereby creating broader possibilities for the semiconductor industry.