Choon Khoon Lim

CEO, Advanced Packaging, Semiconductor Solutions, ASMPT

Choon Khoon Lim (CK) is a Senior Vice President and Chief Executive Officer of Semiconductor Solutions Advanced Packaging (AP).

CK's career spans key engineering, manufacturing, and regional functional and global general management roles with several global semiconductor companies. As Chief Executive Officer of the Segment’s AP Business Group, he helps provide the industry’s leading first-level interconnect technologies covering leading AP First Level Interconnect (FLI) technologies for logic, HBM, Si Photonics & Co-Packaged Optics, wafer die singulation solution for advanced fabricated wafers and Panel ECD for fine Line/Space organic and glass substrate & Wafer PVD, that are well-positioned to serve and to scale with the most demanding AP needs.

CK holds a Bachelor of Science (Honours) in Production Engineering and Production Management degree from the University of Nottingham, United Kingdom.

Speech Abstract:

Enabling the AI era

The AI era has arrived and to enable and perpetuate it, the key building blocks will be Advanced Packaging (AP) semiconductors. Going forward, the AP industry and supply chain needs to innovate at a torrid pace to stay in tandem with the exponential growth of the Gen AI and AI ASIC computing trajectory. As a first mover in AP, ASMPT has been investing in the last 10 years to lead in end-to-end solutions for chiplets heterogeneous integration of the most advanced chip architecture in CoWoS and HBM. The AP industry is undergoing a “Power of N” transformation where fine interconnect pitch shall shrink rapidly along with thinner and bigger packaging formats, demanding breakthrough technologies in materials, process and equipment. This signals a need for a robust ecosystem to continuously re-invent advanced packaging technologies to enable AI scaling.