|
Elvino da Silveira Vice president of business development, Rudolph Technologies |
|
个人简介 Vice president of business development at Rudolph Technologies, with responsibilities to identify new markets and develop strategies to prosecute the opportunities. Until the Rudolph acquisition in December 2012, he served as president and operations manager of Azores since its inception in March 1999. Prior to forming the company, he was employed by MRS Technology, Inc., as the vice president of operations and worldwide customer support. da Silveira has also held engineering and customer support roles at Hampshire Instruments from 1991 to 1993 and GCA/General Signal from 1984 to 1991. Mr. da Silveira holds a B.S. in Mechanical Engineering from Northeastern University. 摘要 The increasing proliferation of smartphones and wearables continues to drive manufacturers to increased performance and portability in order to differentiate their products. A key component in any mobile product is the display. In order to meet the evolving consumer requirements, FPD suppliers continue to introduce displays with technologies such as OLED and a flexible substrate. As these technologies migrate to larger volumes and broader adoption, the lithography process utilized in the display fabrication must evolve to meet the ever-improving performance requirements. These requirements include, imaging finer features, tighter overlay control, faster tact times on substrate that are thinner and less dimensional stability. To overcome these challenges, lithography system must overcome these challenges and must accomplish this while continuing to reduce cost-of-ownership (COO). This talk, introduces a novel lithography approach to overcome the challenges while at the same time lowering the tooling costs and reducing footprints. To achieve superior imaging and overlay this a suite of on-board metrology is used. The optical system design allows the use of standard IC mask in order to reduce tolling cost. Finally, the system utilizes a parallel processing that simultaneously imagines multiple areas of the substrate in order to increase tact and reduce footprint. The result is a system that meets the current requirements of AMOLED fabrication at a superior COO. |
|
