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March 20-22, 2019
Shanghai New International Expo Centre

SIIP China: SEMI Innovation and Investment Forum 2019

SIIP China: SEMI Innovation and Investment Forum

Date: Thursday, March 21, 2019
Time: 09:00 – 16:50
Venue: Grand Shanghai Ballroom 1, 3F, Kerry Hotel Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

SIIP China, SEMI Innovation Investment Platform, aims to be one of the most collaborative and influential investment platform for global semiconductor industry by leveraging SEMI global industrial resources, together with global industrial capital and intelligence. SIIP China: SEMI Innovation and Investment Forum, is one of SIIP China's brand activities held simultaneously with the annual SEMICON China. Besides the Forum, the SIIP China series include Matchmaking Sessions, Theme Discussions, Regular Industry Investment Gathering and Overseas Delegations.

New applications such as Artificial Intelligence, Cloud Computing, Big Data and IoT are bringing big changes to the semiconductor industry. It is expected that 5G will have even more dramatic effects on our daily lives by its higher speed, bigger capacity and low latency. The global semiconductor industry is entering a major period of transition. Being the biggest integrated circuit consumer market in the world, China has been keeping a two-digit growth these years. The trade friction may have added some uncertainty however we look forward to the promising future from the global perspective. No matter how erratic the external environment is, funds, technology, products and talents have always been the key driving forces for the entire eco-system of semiconductor to grow steadily and healthily.

SIIP China: SEMI Innovation and Investment Forum 2019 will focus on the latest policies, diagnose the current situation of the industry, analyze the capital flows and forecast the future. The New-tech Panel will discuss about how deep learning, big data & cloud computing, 5G and manufacturing will bring dramatic changes to the semiconductor industry and what the perspectives of the China market will be.

In 2018, SEMI completed the integration of Electronic System Design Alliance (ESDA). Consisting of major EDA, IP, and fabless companies, ESDA acts as the central voice to communicate and promote the value of the semiconductor design industry as a vital component of the global electronics industry. The ESDA integration brings key capability and further enhances SEMI's supply-chain coverage and SEMI's vertical application platforms such as Smart Transportation, Smart Manufacturing and Smart Data as well as key enabling technologies including AI, 5G, and Machine Learning. During the ESDA Executive Panel, leading companies such as Alibaba, Mentor, Synopsis, Unisoc and Cadence will talk about their cutting-edge technologies.

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Agenda / 会议日程: (Tentative agenda and yet to be confirmed 详细日程有待确定)
   
09:00-09:30 Registration 来宾登记
   
09:30-09:35
Welcome Remarks and Introduction of the Moderator 开幕致辞并介绍主持人
Lung Chu
President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁、中国区总裁
   
09:35-09:45
Moderator introduces Speakers 主持人介绍出席嘉宾
Liang Sheng
BDA Administrative Commission Director
梁胜,北京经济技术开发区管委会主任
   
09:45-10:00
Keynote Remarks 贵宾致辞
Ding Wenwu
President, China National IC Industry Investment Fund
Chairman, China High-end Integrated Circuits Alliance
丁文武,国家集成电路投资基金总裁,中国高端芯片联盟理事长
   
  AM Speeches 嘉宾演讲
   
10:00-10:20
影响集成电路未来的几项技术
Wei Shaojun
Director, Institute of Microelectronics, Tsinghua University
魏少军,清华大学微电子学研究所所长
   
10:20-10:40
Link of OEM and Chip Brings Leap-Forward Development
Shen Weiguo
Chairman of the Board, Shanghai Integrated Circuit Industry Investment Fund
General Manager, Shanghai S&T Investment Co., Ltd.
沈伟国,上海集成电路产业投资基金董事长,上海科技创业投资(集团)有限公司董事总经理
   
10:40-11:00
Semiconductor Outlook: Change is in the Air
Roger Sheng
VP Analyst, Gartner Semiconductors & Electronics research group
盛陵海,研究副总裁,半导体和电子研究,Gartner
   
11:00-11:20
Impact of AI on the China Semiconductor and Electronics Ecosystem
Handel Jones
CEO, International Business Strategies, Inc.
韩徳尔•琼斯,International Business Strategies首席执行官
   
11:20-11:40
中国集成电路产业再定位
Ye Tianchun
Director, Institute of Microelectronics Chinese Academy of Sciences
叶甜春,中国科学院微电子研究所所长
   
11:40-13:30 Lunch break / 午休
   
  PM Sessions 下午日程
   
13:30-15:00 Panel Discussion 圆桌论坛
Topic: New Technologies and Perspectives on China Market
主题:新技术及中国市场展望
   
  Moderator / 主持人
Charlie Chan
Executive Director, Morgan Stanley
詹家鸿,摩根士丹利证券执行董事
   
  Panel Discussion嘉宾:
   
Charlie Chan
Executive Director, Morgan Stanley
詹家鸿,摩根士丹利证券执行董事
   
Thin-film Processing Technologies for Smart Society
Koukou Suu
Senior Fellow and General Manager of Global Market & Technology Strategy, ULVAC
邹弘纲,爱发科集团全球市场和技术战略总经理
   
在全球化的半导体产业竞争中胜出
Allen Lu
President & CEO, Bei Jing E-Town Semiconductor Technology Co., LTD
陆郝安,北京屹唐半导体科技有限公司总裁兼首席执行官
   
Leopold Beer
VP Product Management in Automotive Electronics, Bosch
   
Steve Johnston
Director, Supplier Technology and Industry Development, Global Supply Management, Intel Corporation
   
15:00-16:40 Electronics System Design Executive Session 电子系统设计高峰论坛
Topic: AI-enabled Smart Application Opportunities and IC Design Solutions
主题: AI驱动的智能应用机遇和IC设计解决方案
   
Welcome remarks 欢迎致辞
Lung Chu
President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁、中国区总裁
   
Opening remarks 论坛致辞
Ajit Manocha
President & CEO, SEMI
Ajit Manocha, SEMI总裁兼首席执行官
   
  Panel Discussion
   
  Moderator:
Xiaoning Qi
Vice President, Alibaba Group
戚肖宁,阿里巴巴集团副总裁
   
  Panelists:
   
AI-Enabled Smart Applications: Opportunities, Challenges and Solutions
Xiaoning Qi
Vice President, Alibaba Group
戚肖宁,阿里巴巴集团副总裁
   
Approach for Domain Specific Designs & Autonomous Vehicles
Danny Perng
PacRim Vice President, Mentor, A Siemens Business
彭启煌,全球资深副总裁及亚太区总裁,明导科技
   
Artificial Intelligence-The Future of Smart Chip Design
David-RJ Lin
Corporate Senior President, AsiaPac Region, Synopsys Inc.
林荣坚,全球资深副总裁及亚太区总裁,新思科技公司
   
IC大市场的危与机
Eric Zhou
Marketing VP, UNISOC
周晨,北京紫光展锐科技有限公司市场部部长
   
A.I. / Machine Learning: Driving Force for New Generation of EDA Innovation
Qi Wang
VP of Cadence Design Systems Inc. and the CEO of Nanjing Kaiding Electronics Technology Co. Ltd.
王琦,Cadence全球副总裁及南京凯鼎电子科技有限公司总经理
   
AI-enabled Smart Applications
Opportunities and IC Design Solutions

Balachandran Rajendran
Global CTO, Semi / EDA, Unstructured Data Solutions, Dell EMC
   
16:40-16:45 Lucky Draw 幸运抽奖
   
16:45-16:50 Thank you 致谢结束
   
会议议程更新中,以会议现场资料为准。